Skip to content
  • Home
  • Technological capability
    • PCB Design & Layout Services
    • Design for manufacturing (DFM)
    • PCB Prototypes
    • Delivery
    • Warehousing
  • Services
    • PCB Production
    • PCB Compliance
    • PCB Data Security
    • PCB Design & Layout Services
    • PCB Layout Service
  • Resources
    • Design Center
    • News
    • Events
  • About
    • Who are we
    • Contact us
Menu
  • Home
  • Technological capability
    • PCB Design & Layout Services
    • Design for manufacturing (DFM)
    • PCB Prototypes
    • Delivery
    • Warehousing
  • Services
    • PCB Production
    • PCB Compliance
    • PCB Data Security
    • PCB Design & Layout Services
    • PCB Layout Service
  • Resources
    • Design Center
    • News
    • Events
  • About
    • Who are we
    • Contact us
Home
Technological capability
PCB Design & Layout Services
Design for manufacturing (DFM)
PCB Prototypes
Delivery
Warehousing
Services
PCB Production
PCB Compliance
PCB Data Security
PCB Design & Layout Services
PCB Layout Service
Resources
Design Center
News
Events
About
Who are we
Contact us
Home
News
PCB Lamination
PCB Lamination
byadmin

PCB Lamination

When choosing PCB technology for your board, you should know that the PCB factory has different lamination options to meet your required PCB technology on your board. The lamination method used is based on your PCB type and in addition on the type of PCB technology you will apply to the PCB during the PCB process.

The Lamination Process
Multilayer lamination
The Lamination Process

The lamination process

Before understanding the lamination process in a PCB factory, you must first understand the materials from which you can build your lamination. A PCB typically contains various components, such as copper layer, prepreg (resin/glass fiber) and inner layers. These are key components and can be supplied in many thicknesses and material variations.

This is what an inlay looks like:

An inner layer is typically pre-laminated by the material supplier, who will supply this to the printed circuit board factory in various thicknesses, sizes and types. The material supplier laminates 2 horizontal copper sheets together by separating them with a dielectric. Here are some thickness examples: 0.1mm, 0.2mm, 0.3mm, 0.51mm, 0.76mm, 1.0mm, 1.2mm and 1.55mm.

This is what a Prepreg sheet looks like:

The thicknesses and their properties are many, but here are some of the most common types: 106 = 0.05 mm, 1067 = 0.066 mm, 1080 = 0.075 mm, 2113 = 0.1066 mm, 2116 = 0.12 mm, 7628 = 0.19 mm.

Prepreg sheets are layers of glue and are typically a combination of fiberglass weave and a resin. Prepregs vary in many thicknesses and weave types.Prepreg sheets are used in the lamination process to glue inner layers together or to glue individual copper sheets and an inner layer together.

The material supplier can also supply a laminated dielectric with only one copper sheet. This is known as a one-sided lamination and looks like this:

Multilayer lamination

Multilayer lamination

If you need more than 2 layers of copper on your PCB, the PCB supplier will use all of the above sheet types as components to build a multi-layer PCB.

A 4-layer PCB is laminated by the PCB factory using 2 inner layers, which are separated by one or more prepregs. Adding more prepregs helps you meet the overall thickness. This is the most commonly used 4-layer PCB and is also the cheaper option as each inner layer will be etched and processed simultaneously before being laminated. This type is usually not relevant for HDI.

The alternative 4-layer PCB is actually HDI-friendly, but also more expensive, as the PCB factory needs more components and more time for processing. It can be laminated using individual copper sheets for the top and bottom layers, with an inner layer in the middle. The inner layer and the top and bottom copper plates are separated with prepreg. First, the inner layer is treated (etched), and then it is laminated. After lamination, the top and bottom copper plates will be etched. Building up an even greater number of layers will require the factory to apply additional inner layers or prepregs and copper sheets on examples over 4 layers.

If considering HDI, sequential lamination may be required. For sequential lamination, the board will undergo at least two lamination processes, but depending on the interconnection of vias between the layers, it may be necessary to undergo additional lamination processes. Sequential lamination is generally driven by computer chip packaging, mobile phone, medical products and satellite industries, where the customer use of small BGA packages is high and the thin and tight fanout is required.

Designing a printed circuit board, choosing the use of technology and design rules for optimized and cheapest manufacturing requires extensive know-how about the limitations of the technology used. Keep in mind that there is often more than one technology that meets your requirements, but understanding the best alternative usually takes years to master. If you need guidance, seek out people with expertise in the field and they will help you navigate through the jungle of PCB technology choices that will best meet your demand.

Share this post:

latest news

Warehousing

What do we offer?

Power Supply

Semiconductors

Medical

Related News:

Warehousing
48570931200X775
At Azitech, we know that it is a vital part to have a solid distribution...
Read More
Warehousing
At Azitech, we know that it is a vital part to have a solid distribution and warehousing strategy. It may be of fundamental necessity to be able to compete in a global environment. We have a strategic collaboration with our suppliers, which means that we can integrate a fixed delivery agreement which makes it flexible...
48570931200X775
Warehousing
48570931200X775
At Azitech, we know that it is a vital part to have a solid distribution...
Read More
What do we offer?
dylan-gillis-KdeqA3aTnBY-unsplash
At Azitech we always do our outmost to satisfy our costumers. Our primary job is...
Read More
What do we offer?
At Azitech we always do our outmost to satisfy our costumers. Our primary job is to support and take care of everything related to PCB’s. We aid you from start to finish in the entire process, and we always try to find solutions that satisfy the expectations of our customers. We can handle everything related...
dylan-gillis-KdeqA3aTnBY-unsplash
What do we offer?
dylan-gillis-KdeqA3aTnBY-unsplash
At Azitech we always do our outmost to satisfy our costumers. Our primary job is...
Read More
PCB Lamination
motherboard-pcb
PCB Lamination When choosing PCB technology for your board, you should know that the PCB...
Read More
PCB Lamination
PCB Lamination When choosing PCB technology for your board, you should know that the PCB factory has different lamination options to meet your required PCB technology on your board. The lamination method used is based on your PCB type and in addition on the type of PCB technology you will apply to the PCB during...
motherboard-pcb
PCB Lamination
motherboard-pcb
PCB Lamination When choosing PCB technology for your board, you should know that the PCB...
Read More
Fineline Width and line spacing
louis-reed-wSTCaQpiLtc-unsplash-scaled
Chemical etching of a PCB is usually done with ammonium persulfate or ferric chloride. The...
Read More
Fineline Width and line spacing
Chemical etching of a PCB is usually done with ammonium persulfate or ferric chloride. The thickness of standard copper sheets are typically 18 µm or 35 µm. Higher accuracy and fineline etching can be achieved by reducing the copper sheets thickness to 12, 9 or even 6 µm. Keep in mind that in most cases...
louis-reed-wSTCaQpiLtc-unsplash-scaled
Fineline Width and line spacing
louis-reed-wSTCaQpiLtc-unsplash-scaled
Chemical etching of a PCB is usually done with ammonium persulfate or ferric chloride. The...
Read More
PCB Layout Guide
design-layout-scaled
Designing your board is a very important and exciting stage in the PCB development. There...
Read More
PCB Layout Guide
Designing your board is a very important and exciting stage in the PCB development. There are many limitations and requirements that need you need to remember when designing it. Making a mistake in the design phase will cause starting all over again and result in starting another production if it is not caugt in the...
design-layout-scaled
PCB Layout Guide
design-layout-scaled
Designing your board is a very important and exciting stage in the PCB development. There...
Read More
Surface finish for PCB by Azitech ApS
shutterstock_738033661-scaled
Choosing the correct PCB surface finish for your application requires taking factors into account like...
Read More
Surface finish for PCB by Azitech ApS
Choosing the correct PCB surface finish for your application requires taking factors into account like cost, the final application requirement like solder joint strength, high-heat, thermal, vibration, stability, RF, component density, single or multiple solder processes, shelf life, shock, drop resistance, production volume, and throughput. Selecting the right surface finish is therefore extremely important to...
shutterstock_738033661-scaled
Surface finish for PCB by Azitech ApS
shutterstock_738033661-scaled
Choosing the correct PCB surface finish for your application requires taking factors into account like...
Read More

Post navigation

Fineline Width and line spacing
HDI Technology

Join Our Newsletter

Dont miss out on our latest news, product releases and guides.

PCB technologies

  • PCB Production
  • PCB Compliance
  • Data Security
  • PCB Design
  • PCB Layout

Resources

  • Design Center
  • Events
  • News

Who we are

  • Meet The Team
  • About
  • Contact
  • Careers
  • Privacy Policy

Newsletter

Subscribe to our sales newsletter to stay up to date with our latest products and services.

© Azitech 2023, All rigths reserved

Azitech ApS ● Industrivej 2, 5550 Langeskov, Denmark ● CVR: 29417717

  • Office hours Mon - Fri 08.00 - 16.00
  • Tel: +45 6613 0768
  • Email: support@azitech.dk
Facebook-f Linkedin Youtube

designed by adtify.dk

Azitech ApS ● Industrivej 2, 5550 Langeskov, Denmark ● CVR: 29417717

  • Office hours Mon - Fri 08.00 - 16.00
  • Tel: +45 6613 0768
  • Email: support@azitech.dk
© Azitech 2023, All rigths reserved
Facebook-f Linkedin Youtube

designed by adtify.dk