Designing with BGAs is much more challenging than in the past! The ball pitches are going down and the total pin counts and package size are going up, making everything more complex. With those changes, the signal integrity and EMI issues become more profound, the fanout of the signals is much more challenging, and the power connections and thermal issues are more difficult.
Add to that the manufacturing concerns that have surfaced from small pad sizes and tiny capacitors, and the designer has to face some real complex issues. In this presentation, we will discuss all of those things and more, including choosing effective BGAs, placement for components and caps, grid systems for parts and route-out, some fanout possibilities, and some manufacturing issues unique to these kinds of designs. This class has lots of illustrations and examples!
Add to that the manufacturing concerns that have surfaced from small pad sizes and tiny capacitors, and the designer has to face some real complex issues. In this presentation, we will discuss all of those things and more, including choosing effective BGAs, placement for components and caps, grid systems for parts and route-out, some fanout possibilities, and some manufacturing issues unique to these kinds of designs. This class has lots of illustrations and examples!
