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Location: Paris, France

Date: Postponed due to Corona Virus.

Control of Noise, EMI & SI seminar (2 days)

Knowing how to design circuit boards to contain and control energy (fields) and knowing how to mitigate and control the effects of high speed devices is the key to successful design of low noise circuits. This 2 day seminar with signal integrity guru, Richard Hartley, is a crisp focus of the issues PCB designers and engineers need to know to prevent problems with noise, EMI & signal integrity. Moreover, you will learn how to deal with cross-talk and grounding problems in high speed digital and mixed signal designs.

Every seminar participant got something out of this noise, EMI & signal integrity seminar the last time it was held. It received 4,8 stars out of 5 stars!

Price for the Seminar:
Seminar: 1100
Seminar including One Night: 1250
Seminar including Two Nights: 1400

 

Day 1 –
• Impact of frequency on PCB layout
• Frequency – analog vs. digital
• Lumped vs. distributed length lines
• Basic essentials of Grounding
• Noise – what is it and why it occurs
• Where energy travels in circuits
• Transmission lines and return current paths
• Grounding concepts to Avoid!
• Critical Importance of proper plane assignment
• Common misuse of planes
• Routing and reflections
• Propagation Time and Velocity
• Impact of nearby traces on impedance
• Importance of Reflection Mode Switching
• New thoughts on line termination
• Impact of long Ts in transmission lines
• Proper DDR routing
• Vcc and ground bounce
• Cross Talk … what is it … exactly
• Determining levels of Cross Talk
• Guard Traces – Useful or Not
• Differential pair basics
• Differential impedance … what really matters
• Differential pair cross talk
• Differential pair length matching and skew issues
• Differential line termination styles

Day 2 –

• Basic types of EMI
• Antenna basics and radiators in systems
• Keys to controlling common mode energy
• Component placement impact on EMI
• Ground- To Split or not to Split
• Extreme Importance of I/O connector placement
• Impact of connector pin assignments
• Board routing to control EMI and noise
• Power distribution and decoupling
• Inductance of Vias, Planes and Capacitors
• Capacitor placement vs. Via Inductance
• IC impact on power system noise
• Decoupling boards without power planes
• Decoupling conventional 4-layer boards
• Decoupling high layer count boards
• Impact of via and plane inductance
• Analog IC decoupling
• Ferrites in the power bus
• Plane pairs with Ultra-thin dielectrics
• Extreme importance of PCB stack-up
• PCB stack-ups that work for SI and EMI control
• Severely Improved 4 Layer boards
• Much Improved 6 and 8 Layer boards
• PC Board Stack-ups to Avoid at all costs!
• I/O filtering- Low and high frequency
• I/O setup- Metal vs. plastic enclosures
• Slots and openings in enclosures
• Proper shielding of cables, low and high frequency
• How many cables inside the system?
• Routing of internal and external cables
• Heatsinks and EMI
• Using chassis as a heatsink.
• Switch Mode Power Supplies – Layout to control EMI

About instructor

Richard Hartley, Noise, EMI & signal integrity expert

Rick Hartley is the Principal of RHartley Enterprises through which he consults and teaches internationally. Rick’s focus is on correct design of PC boards to prevent & solve noise, EMI and signal integrity problems. He has consulted with major corporations in Australia, Brazil, Canada, China, England, France, Germany, Japan, Mexico, Spain and the US.

His design career has focused on circuits and PC boards for computers, aircraft avionics, telecommunications and the automotive industry. Rick has a degree in engineering from Ohio Technical Institute and 50 years of experience in electronics. He has dedicated the past 38 years to PC board and circuit development with emphasis on control of noise, in both Digital and RF circuits.

He is a past member of the Editorial Review Board of Printed Circuit Design Magazine and has written many technical papers on methods to control EMI and signal integrity. He is currently on the IPC Designers Council Executive Board, is a past president of the Greater Ohio IPC DC Chapter and is a past international chairman of the IPC Designers Council.