Event highlights

The agenda blended high-level strategy with hands-on demonstrations — a format that resonated with both business leaders and technical engineers. Key moments included:

  • Keynote topics: advanced PCB materials, design-for-manufacturability (DFM), thermal management, and test automation.
  • Demo sessions: live PCB layout walkthroughs, automated test rigs, and a Cadence workflow demonstration showing quicker iteration cycles.
  • Panel discussions: supply-chain resilience, certification for defence & aerospace, and design validation for high-speed signaling.
  • Networking: structured roundtables, 1:1 meeting slots, and an evening reception that seeded multiple follow-ups.

Concrete outcomes emerged quickly: several OEM–manufacturer partnership conversations were opened, pilot projects were proposed for high-reliability board builds, and a shared direction to integrate test automation earlier in development was agreed.

Who attended

The breadth of attendees underscored the seminar's cross-sector reach. Representatives ranged from R&D teams to large systems integrators — proof that this was more than a niche PCB design event, but a full-scale electronics seminar for industry.

World map showing participating countries from the Azitech PCB seminar

This participation reflects strong European representation across defence & aerospace, industrial automation, telecom, instrumentation, manufacturing, energy, maritime and R&D — illustrating the practical, cross-sector relevance of modern PCB work.

What we learned

Attendees left with actionable takeaways that can be applied immediately to product roadmaps and procurement decisions.

  • Advanced PCB materials are now a strategic lever for both thermal and signal integrity gains in high-speed designs.
  • Design-for-manufacturability must be embedded earlier — simple layout rules and automated DFM checks materially reduced rework in several case studies.
  • Test automation has shifted from "nice to have" to "essential" for teams facing tight time-to-market pressures; in-line diagnostics and automated rigs were particularly well received.
  • Cross-tool interoperability, demonstrated through Cadence integrations, showed real savings in design cycles and fewer handover errors between ECAD/MCAD and test platforms.

Quick action points for attendees:

  • Run DFM checks before first prototype.
  • Evaluate higher-performance substrates for thermal-limited systems.
  • Begin automating core test scripts to compress validation timelines.

Delegate feedback & next steps

Early feedback has been overwhelmingly positive.

Thumbnail 1 Thumbnail 2 Thumbnail 3
"The seminar condensed decades of practical PCB know-how into actionable takeaways."
"Clear presenters and high-quality demos — we left with partnership leads and concrete next steps."

Attendees praised the clarity of presenters, the quality of demos, and the value of structured networking. Final attendee metrics and survey figures are being compiled and will be published soon.

Request access to our complete seminar materials including photos, presentation slides, and technical documentation.

Visit events page