Lamination
Lamination is the process in which multiple layers are joined to create a PCB. Multi-layer printed circuit boards have trace layers inside the board. This is achieved by laminating a stack of materials in a press by applying pressure and heat for a period of time. This results in an inseparable one-piece product. For example, a four-layer PCB can be fabricated by starting from a two-sided copper-clad laminate. Circuitry is etched on both sides and then it is laminated to the top and bottom pre-preg and copper foil. It is then drilled, plated, and etched again to get traces on top and bottom layers.
Azitech is capable of supplying very complex PCB boards with multiple pressing cycles containing micro vias, which have been applied and plated throughout each pressing cycle.
| Lamination | EU | Asia |
|---|---|---|
| Max. layer count | 36 | 56 |
| Max. panel size | 620 mm × 900 mm | 570 mm × 570 mm |
| Board thickness range | 0.15 mm - 12 mm | 0.1 mm - 8 mm |
| Min. prepreg thickness | 50 µm | 50 µm |
| Min. copper sheet thickness | 9 µm | 9 µm |
| Layer to layer registration tolerance | ± 25 µm | ± 76 µm |
| Min. innerlayer core thickness | 0.1 mm | 0.1 mm |