Copper pattern discribe all features on a PCB made from copper, both pads, tracks and other. Azitech is capable of supplying boards with ultra fineline features. This is done by using LDI (Laser Direct Imaging). From multiple suppliers, Azitech can etch finelines down to 50 µm. For volume production in Asia the fineline limit is currently 60 µm.
On request, Azitech can provide you with design rules. For instance those to let you escape a 0.4 mm pitch Micro BGA. Azitech’s partners in Europe also support ultra fineline conductors down to 35 µm. They supply PCBs to various applications like medical implants, hearing aids, and mobile phones.
|Min. track width||35 µm||50 µm|
|Min. space||35 µm||66 µm|
|Track width tolerance||± 20%||± 20%|
|Min. annular ring||50 µm||76 µm|
|PAD to PAD clearance||100 µm||300 µm|
|Hole to PAD clearance||100 µm||250 µm|
|Min. BGA PAD size||150 µm||200 µm|
|Min. captured PAD size (micro via)||250 µm||250 µm|
|Min. target PAD size (micro via)||250 µm||250 µm|
|Impedance||± 5%, ± 10%||± 5%, ± 10%|