Features:
- Lead-Free Assembly Compatible
- Ideally suited for assemblies with a maximum reflow temperature of 245°C
- Nelco N4000-13 has shown acceptable results in reflow conditions up to 260ºC depending on the PCB design and manufacturing processing
- Tg >210ºC, outstanding thermal, electrical and signal loss properties
- Excellent thickness control for tight tolerance impedance applications
- Low Df and Dk allows for low signal distortion and faster signal propogation required by high frequency (1 - 10 GHz) and high reliability applications
- CAF2 Resistant
- The low Z-CTE and proven CAF resistance provide long-term reliability for both RF and digital applications
- Signal Integrity and Buried CapacitanceTM Options
- When used, SI glass provides enhanced electrical performance for even the most demanding applications
- Approved ZBC-2000® substrate available for thinner, more reliable assemblies and increased board densities
- High-Tg FR-4 processing
- Processes similar to traditional high Tg FR-4 materials
- 90 min press at 193ºC and 275-350 psi
- Available in a variety of constructions
- Vacuum laminated
- Available in a wide variety of constructions, copper weights and glass styles including standard copper, double treat and RTFOIL laminate.
- Meets UL 94V-0 and IPC-4101/29 specifications
- All Nelco materials are RoHS compliant.
Applications:
- Fine-Line Multilayers
- Backplanes
- Surface-Mount Multilayers
- BGA Multilayers
- MCM-Ls
- CSP Attachment
- Wireless Communication Infrastructure
- High Speed Services
- High Speed Storage Networks
- Internet Switching / Routing Systems