Nelco N4000-13, N4000-13 SI

Nelco N4000-13, N4000-13 SI

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  • Lead-Free Assembly Compatible
  • Ideally suited for assemblies with a maximum reflow temperature of 245°C
  • Nelco N4000-13 has shown acceptable results in reflow conditions up to 260ºC depending on the PCB design and manufacturing processing
  • Tg >210ºC, outstanding thermal, electrical and signal loss properties
  • Excellent thickness control for tight tolerance impedance applications
  • Low Df and Dk allows for low signal distortion and faster signal propogation required by high frequency (1 - 10 GHz) and high reliability applications
  • CAF2 Resistant
  • The low Z-CTE and proven CAF resistance provide long-term reliability for both RF and digital applications
  • Signal Integrity and Buried CapacitanceTM Options
  • When used, SI glass provides enhanced electrical performance for even the most demanding applications
  • Approved ZBC-2000® substrate available for thinner, more reliable assemblies and increased board densities
  • High-Tg FR-4 processing
  • Processes similar to traditional high Tg FR-4 materials
  • 90 min press at 193ºC and 275-350 psi
  • Available in a variety of constructions
  • Vacuum laminated
  • Available in a wide variety of constructions, copper weights and glass styles including standard copper, double treat and RTFOIL laminate.
  • Meets UL 94V-0 and IPC-4101/29 specifications
  • All Nelco materials are RoHS compliant.


  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-Ls
  • CSP Attachment
  • Wireless Communication Infrastructure
  • High Speed Services
  • High Speed Storage Networks
  • Internet Switching / Routing Systems