FR408 is high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuity application.
Features:
- Industry Approvals
- IPC-4101D-WAM1 /24 /121 /124
- UL Recognized – FR-4, File Number E41625
- Qualified to UL’s MCIL Program
- High Thermal Performance
- Tg of 180°C (DSC)
- Td of 360°C (@ 5% weight loss)
- Improved Dielectric Properties
- Dk <3.67 2 to 10 GHz >42% resin content
- Df <0.0125 2 to 10 GHz >42% resin content
- UV Blocking and AOI Flourescence
- High throughput and accuracy during PCB fabrication and assembly
- Superior Processing
- Closest to conventional FR-4 processing of all high speed materials
- Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz.
- Heavy foils available on request
- Foil Options: Reverse treat
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 1652, 2113, 2116, 3070, 3313, 7628