DuPont Pyralux AP

DuPont Pyralux AP

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Pyralux AP double-sided, copper-clad laminate is an all-polyimide composite of polyimide film bonded to copper foil. This material system is ideal for multilayer flex and rigid flex applications which require advanced material performance, temperature resistance, and high reliability.


  • Low CTE for rigid flex multilayers
  • Excellent thermal resistance
  • Thin Cu-clads with superior handling
  • Unique thick-core product for controlled impedance
  • Excellent dielectric thickness tolerance/electrical performance
  • High Cu-polyimide adhesion strength
  • Full compatibility with PWB industry processes, IPC 4204/11 certified
  • UL 94V-0, UL 796, 180°C (356°F) max. operating temperature