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medium Tg

Shengyi S1000

Shengyi S1000

Features: Lead-free compatible FR-4 laminate Tg(DSC) 155°C, UV Blocking/ AOI compatible Excellent thermal reliability Z-CTE 30-35% less than conventional FR-4 Excellent T/H reliability Excellent anti-CAF and Q1000 performance Low water absorption Applications Computer, instrumentation, communication equipment, automotive electronics, electronic game machine, and etc.
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Kingboard KB-6165

Kingboard KB-6165

Features: High thermal decomposition temperature(Td) Low CTE Excellent heat resistance and appropriate for lead-free assembly The resin system is Dicy free and no filler Anti-CAF
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ITEQ IT-158

ITEQ IT-158

Features: Low CTE with excellent thermal resistance Tg >150 ℃ (DSC) High thermal decomposition temperature (Td) Lead-free process compatible Extremely robust, good for high reliability board
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EMC EM-285/ EM-285B

EMC EM-285/ EM-285B

Features: Tg - 150 °C (TMA) Lower Df, better stability of Dk / Df Low moisture absorption Lower CTE in Z direction Excellent thermal resistant for lead-free process Excellent CAF resistance Halogen, antimony and red phosphorus free
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