Heat sink PCBs capabilities
Heat sink PCBs are using a passive thermal conductor that transfers the heat generated by an electronic or a mechanical device into a material or space that can obtain the heat. This is often done by making an inlay of copper or aluminium to create a local thermal performance without having to resort to using IMS or heavy copper boards. Another method is to insert or attach a COIN to the board allowing for much better heat dissipation on multilayered boards. Azitech can supply different heat sink solutions ranging from relatively simple inlays and adhesive bonded COIN to Chip-On-Coin.
Heat sInk boards capability | EU | Asia |
---|---|---|
Metal base single layer | Yes | Yes |
Metal base 2 layer | Yes | Yes |
Metal base multilayer | Yes | Yes |
Metal core 2 layer | Yes | Yes |
Available heat sink metals | ||
Aluminium | Yes | Yes |
Copper | Yes | Yes |
Surface finish of metal base | ||
Gold plating | Yes | Yes |
Silver plating | Yes | Yes |
Other | OSP, LFHASL, Immersion tin | Contact Azitech |
Bonding | ||
Pre-bonding | Yes | Yes |
Post-bonding | Yes | Yes |
Adhesive bonded Coins | Yes | Yes |
Embedded Coins | Yes | Yes |
Press-fit for SMD | Yes | No |
Press-fit-Coin with cavity | Yes | Yes |
Chip-on-Coin | Yes | No |