Kapabilitet til Udviklere
Her kan du finde en mere uddybet forklaring af blandt andet, hvilke typer printkort, forskellige boringer, vias og overfladebehandlinger der er muligt at benytte i designet af printkortet.
Du kan finde dem i den venstre sidebar af denne side.
| PCB Types | EU | ASIA | |
| Rigid boards | 36 Layers | 56 Layers | |
| Rigid Flex boards | 20 layers - 10 flex layers | 18 layers - 10 flex layers | |
| Flex boards | 1-10 Layers | 1-14 Layers | |
| Heat sink boards | 2 Layers | 6 Layers | |
| PTFE boards* | 4 Layers | 10 Layers | |
| Heavy copper boards | 10 Layers | 12 Layers | |
| Embedded components | Yes | Yes | |
| *Arlon, Taconic and Nelco | |||
| HDI Capability | EU | ASIA | |
| HDI class type I (IPC) | Yes | Yes | |
| HDI class type II (IPC) | Yes | Yes | |
| HDI class type III (IPC) | Yes | Yes | |
| HDI class type ELIC (IPC) | Yes | Yes | |
| VIA Technology | EU | ASIA | |
| Standard PTH | Yes | Yes | |
| Blind Vias | Yes | Yes | |
| Buried Vias | Yes | Yes | |
| Stacked Vias | Yes | Yes | |
| Staggered Vias | Yes | Yes | |
| Skip Vias | Yes | Yes | |
| Stepped Micro Vias | Yes | Yes | |
| Vias in PAD | Yes | Yes | |
| Resin plugged vias overplated | Yes | Yes | |
| Copper filled vias | Yes | Yes | |
| Approvals | EU | ASIA | |
| (Manufacturing) ISO 9001 | Yes | Yes | |
| (Environment) ISO 14001 | Yes | Yes | |
| UL796 for rigid | Yes | Yes | |
| UL796 for flex | Yes | Yes | |
| IPC 6012 class 2 | Yes | Yes | |
| IPC 6012 class 3 | Yes | Yes | |
| IPC PCQR 2 | Yes | Yes | |
| (Medical) ISO13485 | Yes | Yes | |
| (Automotive) ISO/TS16949 | Yes | Yes | |
| MIL-PRF-31032 | No | Yes | |
| AS9100 | Yes | Yes | |
| PPAP | No | Yes | |
| Surface finishes | EU | ASIA | |
| LF HASL | Yes | Yes | |
| ENIG | Yes | Yes | |
| Immersion tin | Yes | Yes | |
| Immersion silver | Yes | Yes | |
| OSP | Yes | Yes | |
| ENEPIG | Yes | Yes | |
| HASL(Sn-Pb) | Yes | Yes | |
| Electrolytic Ni/Au | Yes | Yes | |
| DIG | Yes | Yes | |
| Electroless nickel immersion palladium | No | No | |
| Carbon ink | Yes | Yes | |
| Blue Mask* * Peelable mask | Yes | Yes | |
| Lamination | EU | ASIA | |
| Max. layer count | 36 | 56 | |
| Max. panel size | 620 mm X 900 mm | 570 mm X 570 mm | |
| Board thickness range | 0.15 mm -12 mm | 0.1 mm - 8 mm | |
| Min. prepreg thickness | 50 μm | 50 μm | |
| Min. copper sheet thickness | 9 μm | 9 μm | |
| Layer to layer registration tolerance | ± 25 μm | ± 76 μm | |
| Min. innerlayer core thickness | 0.1 mm | 0.1 mm | |
| Plating | EU | ASIA | |
| SBU (Sequental lamination) | 7+n+7 | 6+n+6 | |
| Max. PTH aspect ratio | 24:1 | 16:1 | |
| Micro via aspect ratio | 1:1 | 0.73:1 | |
| Max. hole plating thickness | 25 μm | 25 μm | |
| Max. plating on base copper | 25 μm | 25 μm | |
| Filled micro via planarity | 5 μm | 5 - 7 μm | |
| Drilling | EU | ASIA | |
| Plated through hole drill range | 0.1 mm - 6.5 mm | 0.15 mm - 6.5 mm | |
| PTH FHS size tolerance | ± 0.050 mm | ± 0.075 mm | |
| Drill position tolerance (PTH) | ± 0.020 mm | ± 0.075 mm | |
| Drill position of non-plated holes | ± 0.050 mm | ± 0.040 mm | |
| Hole to hole position tolerance | ± 0.050 mm | ± 0.040 mm | |
| Min. hole to hole position clearance | 0.150 mm | 0.175 mm | |
| Smallest controlled depth drill | 0.150 mm | 0.200 mm | |
| Largest controlled drill depth | No limit | No limit | |
| Depth drill min. dielectric isolation | 0.2 mm | 0.3 mm | |
| Controlled depth drill tolerance | ± 0.010 mm | ± 0.040 mm | |
| Copper Pattern | EU | ASIA | |
| Min. track width | 35 μm | 50 μm | |
| Min. space | 35 μm | 66 μm | |
| Track width tolerance | ± 20 % | ± 20 % | |
| Min. annular ring | 50 μm | 76 μm | |
| PAD to PAD clearance | 100 μm | 300 μm | |
| Hole to PAD clearance | 100 μm | 250 μm | |
| Min. BGA PAD size | 150 μm | 200 μm | |
| Min. captured PAD size (micro via) | 250 μm | 250 μm | |
| Min. target PAD size (micro via) | 250 μm | 250 μm | |
| Impedance | ± 5 %, ± 10 % | ± 5 %, ± 10 % | |
| Fineline width and line spacing | EU | ASIA | STANDARD |
| 9 μm innerlayer | 50 μm | 50 μm | 80 μm |
| 12 μm innerlayer | 50 μm | 66 μm | 90 μm |
| 18 μm innerlayer | 50 μm | 80 μm | 100 μm |
| 35 μm innerlayer | 50 μm | 90 μm | 125 μm |
| 43 μm innerlayer | 100 μm | 100 μm | 150 μm |
| 70 μm innerlayer | 150 μm | 150 μm | 250 μm |
| 105 μm innerlayer | 200 μm | 180 μm | 300 μm |
| 140 μm innerlayer | 250 μm | 225 μm | 350 μm |
| 175 μm innerlayer | 250 μm | 250 μm | 400 μm |
| 210 μm innerlayer | 250 μm | 300 μm | 500 μm |
| Conductor line width and space tolerance | ± 20 % | ± 20 % | |
| Solder mask and silk screen | EU | ASIA | |
| Min. solder mask bridge | 60 μm | 75 μm | |
| Solder mask clearance (min.) | 30 μm | 76 μm | |
| Solder mask thickness (min.) | 25 μm | 25 μm | |
| Min. silk screen bridge | 0.08 mm | 0.075 mm | |
| Min. silk screen clearance | 0.025 mm | 0.02 mm | |
| Standard silk screen thickness | 0.025 mm | 0.025 mm | |
| Min. blue mask area | 1 mm² | 2 mm (diameter) | |
| Min. blue mask clearance | 1 mm | 0.75 mm | |
| Blue mask thickness | 0.2 - 1.5 mm | 0.2 mm | |
| Blue mask thickness tolerance | ± 0.1 mm | ± 0.1 mm | |
| Carbon to NPTH (min.) | 0.3 mm | 0.3 mm | |
| Clearance of carbon (min.) | 0.35 mm | 0.35 mm | |
| Carbon to carbon (min.) | 0.35 mm | 0.35 mm | |
| Mechanical routing | EU | ASIA | STANDARD |
| Mechanical milling registration tolerance | ± 0.013 mm | ± 0.05 mm | ± 0.05 mm |
| Min. milling tool | 0.50 - 3.175 mm | 0.8 mm | 2.4 mm |
| V-CUT score angle | 30°, 45°, 60° | 30°, 45° | 30° |
| V-CUT tolerance | ± 5° | ± 2° | |
| V-CUT registration tolerance | ± 0.050 mm | ± 0.125 mm | |
| V-CUT web thickness tolerance | ± 0.1 mm | ± 0.050 mm | |
| Micro vias | EU | ASIA | |
| Min. hole size | 100 μm | 100 μm | |
| Min. capture PAD size | 250 μm | 250 μm | |
| Min. target PAD size | 250 μm | 250 μm | |
| Aspect ratio* Preferred micro vias prepregs** | 1:1 | 0.73:1 | |
| Min. plated thickness (micro vias) | 10 μm | 10 μm | |
| Filled micro via planarity | ± 5 μm | ± 5 μm | |
| * Preferred 0.8:1 ** Contact Azitech | |||
| Materials | EU | ASIA | |
| FR4 | Yes | Yes | |
| FR4 Medium Tg | Yes | Yes | |
| CEM 1 | Yes | Yes | |
| CEM 3 | Yes | Yes | |
| Rogers HF laminate | Yes | Yes | |
| Polyimide | Yes | Yes | |
| Teflon laminate | Yes | Yes | |
| Heavy copper boards | EU | ASIA | |
| Layer count | 12 | 36 | |
| Max. copper thickness on outerlayer | 435 μm | 420 μm | |
| Max. hole size | 0.28 mm | 0.5 mm | |
| Max. board thickness | 12 mm | 8 mm | |
| Heat sink boards capability | EU | ASIA | |
| Metal base single layer | Yes | Yes | |
| Metal base 2 layer | Yes | Yes | |
| Metal base multi layer | Yes | Yes | |
| Metal core 2 layer | Yes | Yes | |
| Available heat sink metals | EU | ASIA | |
| Aluminum | Yes | Yes | |
| Copper | Yes | Yes | |
| Surface finish of metal base | EU | ASIA | |
| Gold plating | Yes | Yes | |
| Silver plating | Yes | Yes | |
| Other | OPS, LFHASL, Immersion tin | Contact Azitech | |
| Bonding | EU | ASIA | |
| Pre-bonding | Yes | Yes | |
| Post-bonding | Yes | Yes | |
| Adhesive bonded Coins | Yes | Yes | |
| Embedded Coins | Yes | Yes | |
| Press-fit for SMD | Yes | No | |
| Press-fit-Coin with cavity | Yes | Yes | |
| Chip-on-Coin | Yes | No |